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"Solder Joint Encapsulant Adhesive - POP Assembly Solution" paper was presented by Dr. Wusheng Yin in NEPCON, Shenzhen, China August 29, 2012
NEPCON August 2012
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IMAPS June 2012
"Gold Replacement - Nanofilm for Oxidation Barrier" paper was presented by Dr. Wusheng Yin in IMAPS, Nano Center, Albany, New York, June 14, 2012
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IMAPS October 2011
"A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive" paper was presented by Dr. Wusheng Yin in IMAPS, Long Beach, California, October 9-13, 2011
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IMAPS October 2011
"A Low Cost and High Thermal Conductive Solderable Adhesive" paper was presented by Dr. Wusheng Yin in IMAPS, Long Beach, California, October 9-13, 2011
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SMTA October 2011
"Innovative Rework Solution to Assembled IC Components" paper was presented by Dr. Wusheng Yin in SMTA International Conference, Fort Worth, Texas, Oct. 12-20, 2011
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SMTA October 2011
"A Novel Low Temperature Fast Flow and Fast Cure Reworkable Underfill" paper was presented by Dr. Wusheng Yin in SMTA International Conference, Fort Worth, Texas, Oct, 12-20, 2011
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SEMICON July 2011
"A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure And Flow Reworkable Underfill" paper was presented by Dr. Wusheng Yin in San Fancisco, SEMICON West/IMAPS, July 13, 2011
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IMAPS May 2011
Dr. Wusheng Yin presented "A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive" in IMAPS New England - 38th Symposium & Expo, May 3, 2011
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Dr. Wusheng Yin presented "A Low Cost and High Thermal Conductive Solderable Adhesive" in IMAPS New England - 38th Symposium & Expo, May 3, 2011
IMAPS May 2011
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IMAPS November 2010
Dr. Wusheng Yin presented "Underfill for Ultra-low Bumped (10u) 3D TSV package" in Raleigh NC, IMAPS, November 4, 2010
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IMAPS November 2010
Dr. Wusheng Yin had technical poster "A First Individual Solder Joint Encapsulant Adhesives" in Raleigh NC, IMAPS, November 3, 2010
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NEPCON August 2010
Dr. Wusheng Yin Presented "World First Solder Joint Encapsulant Adhesives" in Shenzhen (China), NEPCON, August 31, 2010
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SEMICON West/IMAPS July 2010
Dr. Wusheng Yin presented "A First Individual Solder Joint Encapsulant Adhesives" in San Francisco, SEMICON West/IMAPS, July 14, 2010
>
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