Eliminates Underfill, High Reliability, Reworkable, and more...
Low Temperature Cure, High Thermal Conductivity, High Electrical Conductivity, and more...
Diamond Underfill, High Thermal Conductivity (>5W/mK), No Resin Bleed, Fast Flow, and more...
Enhance Solder Joint Strength 5-10x, Improve Throughput, 100% Reworkable, and more...
SEMICON West 2017
Moscone Center / BOOTH 5248 north hall
San Francisco, CA
SMTA International 2017
Convention Center / BOOTH 329
Open The Door For:
• 25+ years’ experience
• Worldwide support
• Award winning company
• Premier products
YINCAE Employees are provided with:
•Comfortable Work Environment
•Cooperative Atmosphere Which Fosters Individual Growth
•Hands on Training
Scan the QR code or text "YINCAE" to 22828 to join our email list!
© 2017 YINCAE Advanced Materials, LLC - All Rights Reserved
19 Walker Way, Albany, NY, 12205