Board Level Assembly

 

 

The YINCAE® SMT 256/SMT 266 Product Series is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapulated by 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes. Several products are available in the series, each is formulated to meet specific product design parameters. The SMT 256 products are designed for dip or print applications, whereas the SMT 266 products are designed for automated jetting applications during assembly (and can also be brushed on during rework). A Dip Paste product with similar performance properties is also available. All products in this series provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner. Product Application Notes
Data Sheets for YINCAE products available upon request



BREAKING NEWS: YINCAE Wins Global Technology Award

iMAPS New England 46th Symposium & Expo, May 7. Boxboro, MA.

iMAPS 2019 52nd Symposium on Microelectronics, October 1-3. Boston, MA.

 

 

Upcoming Events

Innovative Leaders

Open The Door For: Innovative leaders • 35+ years’ experience • Worldwide support • Award winning company • Premier products
iMAPS New England 2019 May 7th Boxboro Regency Hotel Boxborough, MA iMAPS Boston 2019 October 1st-3rd Hynes Convention Center

Scan the QR code or text "YINCAE" to 22828 to join our email list!

PROUD SUPPORTER:
Join Our Email List

© 2018 YINCAE Advanced Materials, LLC - All Rights Reserved

19 Walker Way, Albany, NY, 12205

Info@yincae.com

518-452-2880