Board Level Assembly

 

 

 

Data Sheets for YINCAE products available upon request.

The YINCAE®  SMT256/SMT266 Product Series is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications.  They remove metal oxide and allow individual solder joints to be formed, encapulated by 3-D polymer network.   The resulting solder joint bond is  5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

 

Several products are available in the series, each is formulated to meet specific product design parameters. The SMT256 products are designed for dip or print applications, whereas the SMT266 products are designed for automated jetting applications during assembly (and can also be brushed on during rework).  A Dip Paste product with similar performance properties is also available.  All products in this series provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.

Products Application Note



BREAKING NEWS: YINCAE Wins Global Technology Award

IPC Apex 2018, February 27 - March 1. San Diego, CA. Booth #2732

SEMICON WEST 2018, July 11 - 13. San Francisco, CA. Booth #5296

IWLPC 2018, October 24 - 26. San Francisco, CA.

 

 

Upcoming Events

 IPC APEX 2018 February 27th - March 1st San Diego Convention Center Booth # 2732 San Diego, CA SEMICON West 2018 July 11 - 13 Moscone Center, North Hall Booth # 5269 San Francisco, CA

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