Solder Joint Encapsulant for Ball Bumping Applications:

BP 256

 

(Albany, NY) September 19, 2014. YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

 

 

 

 

 

 

 

 

 

 

 

 

YINCAE’s BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. Thus, using BP 256 eliminates the cleaning process due to the nature of epoxy and the later underfilling process. The products are also designed for use in lead-free, Sn/Pb and Sn/Bi processes.

 

Although encapsulant products are not new, the industry has been hard pressed to find an encapsulant that performs like the BP 256. YINCAE’s BP 256 eliminates the need for flux, underfilling, and the cleaning process. BP 256 demonstrates superior performance, can be applied at low temperatures, and is 100% reworkable.

 

Additional information on the product series is available on our Website at: http://www.yincae.com/technical-information.html or by contacting YINCAE at: info@yincae.com *

 

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

 

FOR ADDITIONAL INFORMATION CONTACT:

Tech Support

YINCAE Advanced Materials, LLC

19 Walker Way

Albany, NY 12205

Phone: (518) 452-2880

E-mail: techsupport@yincae.com

 

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

 



BREAKING NEWS: YINCAE Wins Global Technology Award

1. SEMICON WEST 2017, July 11-13. San Francisco, CA. BOOTH 5248 (NORTH HALL)

2. SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

3. IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

Press-Release PDF

 

 

 

 

 

SEMICON West 2017

July 11-13th

Moscone Center / BOOTH 5248 north hall

San Francisco, CA

 

SMTA International 2017

September 19-20th

Donald Stephens

Convention Center / BOOTH 329

Rosemont, IL

 

iMAPS 2017

October 10-12th

Symposium Microelectronics

BOOTH 416

Raleigh, NC

 

 

 

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19 Walker Way, Albany, NY, 12205

Info@yincae.com

518-452-2880

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