An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

 

(Albany, NY)  July 25, 2014.  Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

 

          Increasing miniaturization in the electronic industry is a trend that can clearly be seen as time continues to move forward. The strength of solder joint or interconnects presents a challenging issue as it becomes more difficult to meet customers’ requirements. Underfilling the interconnects of rigid/flexible substrates does not solve the problem. Solder joint encapsulant adhesive (SMT266) provides a reliable solution to the interconnect of rigid/flexible substrates. Using solder joint encapsulant adhesive not only doubles the strength of the interconnect compared to using traditional flux, but also ensures 100% manufacturing process yield. Solder joint encapsulant adhesive is used in line process, thus shortening the manufacturing process. The SMT 266 solder joint encapsulant adhesive provides a solution to all problems that miniaturization can cause.

 

          If you would like to read the full white paper on “An Innovation Reliability Solution Interconnect of Flexible/Rigid Substrates” just click the following link; http://www.yincae.com/assets/white-paper-july2014-1.pdf

 

          Additional information on the product series is available on our Website at http://www.yincae.com/products.html or by contacting YINCAE at info@yincae.com.

 

 

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

 

FOR ADDITIONAL INFORMATION CONTACT:

Tech Support

YINCAE Advanced Materials, LLC

19 Walker Way

Albany, NY  12205

Phone: (518) 452-2880

E-mail: techsupport@yincae.com

 

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* The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

 

 

 

 



BREAKING NEWS: YINCAE Wins Global Technology Award

1. SEMICON WEST 2017, July 11-13. San Francisco, CA. BOOTH 5248 (NORTH HALL)

2. SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

3. IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

Press-Release PDF

 

 

 

 

 

SEMICON West 2017

July 11-13th

Moscone Center / BOOTH 5248 north hall

San Francisco, CA

 

SMTA International 2017

September 19-20th

Donald Stephens

Convention Center / BOOTH 329

Rosemont, IL

 

iMAPS 2017

October 10-12th

Symposium Microelectronics

BOOTH 416

Raleigh, NC

 

 

 

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19 Walker Way, Albany, NY, 12205

Info@yincae.com

518-452-2880

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