An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

(Albany, NY)  July 25, 2014.  Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.


Increasing miniaturization in the electronic industry is a trend that can clearly be seen as time continues to move forward. The strength of solder joint or interconnects presents a challenging issue as it becomes more difficult to meet customers’ requirements. Underfilling the interconnects of rigid/flexible substrates does not solve the problem. Solder joint encapsulant adhesive (SMT266) provides a reliable solution to the interconnect of rigid/flexible substrates. Using solder joint encapsulant adhesive not only doubles the strength of the interconnect compared to using traditional flux, but also ensures 100% manufacturing process yield. Solder joint encapsulant adhesive is used in line process, thus shortening the manufacturing process. The SMT 266 solder joint encapsulant adhesive provides a solution to all problems that miniaturization can cause.


If you would like to read the full white paper on “An Innovation Reliability Solution Interconnect of Flexible/Rigid Substrates” just click the following link;


Additional information on the product series is available on our Website at or by contacting YINCAE at



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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.



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