BREAKING NEWS: YINCAE Wins Global Technology Award

1. SEMICON WEST 2017, July 11-13. San Francisco, CA. BOOTH 5248 (NORTH HALL)

2. SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

3. IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

 

 Frequently Asked Questions

 

 

 

Solder Joint Encapsulants

 

•What are solder joint encapsulant adhesives?

YINCAE solder joint encapsulant adhesives are epoxy based materials with a built-in flux function.

 

During reflow, solder joint encapsulant adhesives remove oxides allowing the solder joint to form, and encapsulate the solder joint in a 3D polymer network.

 

 

•What are the benefits of solder joint encapsulant adhesives?

1. Enhance solder joint strength

2. Improve device reliability

3. Eliminate underfill and the underfilling process

4. Eliminate electrical issues (dendrites, electro-migration…)

5. Eliminates cleaning processes

6. Lower costs

 

 

•How can solder joint encapsulant adhesives lower costs?

1. 100 % reworkable – eliminate scrap cost

2. Air reflowable – eliminate nitrogen cost

3. Lower material usage

4. Short manufacturing process – See comparison below

5. High process yield

 

 

 

                    Underfill Process                               Solder Joint Encapsulant Process

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

•Why is the reliability for solder joint encapsulant adhesives better than underfills?

Eliminate shrinkage factor generated by underfill (gap is filled with air when using solder joint encapsulants) – Less stress improves reliability

 

 

•Can solder joint encapsulants help eliminate head – in – pillow issues?

Yes, solder joint encapsulant products provide additional mechanical strength to solder joints to help mitigate the impact of warpage.

 

 

•Why can electro-migration issues be eliminated using YINCAE solder joint encapsulants?

Solder joint encapsulants encapsulate the solder joints after reflow to prevent dendrite formation.

 

 

•What is BP 256?

BP 256 is a ball bumping adhesives designed to enhance solder joint strength during ball bumping processes

 

Advantages

1. Enhance solder bonding strength

2. Increase throughput

3. Eliminate additional cleaning steps

4. Eliminate underfilling process in SMT production

5. Reduce costs

 

 

•Is there more information BP 256 available?

A brochure specifically for BP 256 with more detailed information and reliability data is located on our website.

 

 

•Is more information (i.e. TDS, additional material options…) for YINCAE solder joint encapsulant products available?

Yes, please contact us using one the links provided below:

 

Contact us for general questions

 

Contact us for technical inquiries

 

 

 

 

 

SEMICON West 2017

July 11-13th

Moscone Center / BOOTH 5248 north hall

San Francisco, CA

 

SMTA International 2017

September 19-20th

Donald Stephens

Convention Center / BOOTH 329

Rosemont, IL

 

iMAPS 2017

October 10-12th

Symposium Microelectronics

BOOTH 416

Raleigh, NC

 

 

 

Open The Door For:

 

 

Innovative leaders

• 25+ years’ experience

• Worldwide support

• Award winning company

• Premier products

 

 

 

 

 

Interested?

 

Contact us:

 

Do you have a question or would like to know more?

Please contact us.

We will be happy to assist you.

 

 

 

Technical Questions

 

General Inquiry

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