Underfill Materials

 

 

The YINCAE® SMT 158 capillary underfill is a combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as a underfill for chip scale package, ball grid array devices, package on package and land grid array and some flip chip applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is environmentally friendly, and designed for high production where process speed and mechanical shock are the key concerns.

 

Several products are available in the series, each is formulated to meet specific product design parameters. SMT 88 Series underfills are adhesives which can be underfilled at room temperature without preheating a substrate. After cure, the underfillls are void free. WL 125 is a pre-applied wafer-level underfill, which is designed for wafer-to-wafer, chip to wafer, chip to chip, and chip to substrate application, particularly for 3-10μ bumped wafer. All products in this series provide a perfect solution for customers looking to strengthen the underfilling process in a 100% reworkable manner.

Products Application Note

Data Sheets for YINCAE products available upon request.



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IWLPC 2018, October 23 - 24. San Jose, CA.

 

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