BREAKING NEWS: YINCAE Wins Global Technology Award

1. SEMICON WEST 2017, July 11-13. San Francisco, CA. BOOTH 5248 (NORTH HALL)

2. SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

3. IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

 

 Frequently Asked Questions

 

 

 

Wafer Level Materials

 

•What underfill materials can be used for wafer level applications?

YINCAE WL 125 series wafer level underfills

 

 

•What die attach adhesive materials can be used for wafer level applications?

YINCAE WL 66H is designed for wafer level die attach applications

 

 

•Does YINCAE offer wafer level lens or optical lens attachment materials?

Yes, YINCAE offers WL 66C, WL 66L, and WL 66O

 

 

•Are the WL 66 C / L / O materials thermal or UV curable?

Both, these products are generally cured using UV for fast fixing purposes and then thermally cured for high reliability.

 

 

•What are the advantages of YINCAE wafer level lens and optical lens attachment materials?

1. High throughput and process yield

2. High reliability

3. Non – Yellowing

 

 

•What is WTA 60 used for?

WTA 60 is a temporary bonding adhesive designed for thin wafer protection. WTA 60 prevents damage to wafers during standard semiconductor equipment processing. It is removed using YINCEA WTR 50.

 

 

•What is WCP 45 used for?

WCP 45 is an aqueous polymer coating designed to protect wafers during laser dicing, drilling, and grooving procedures. It can easily be removed using D.I. water at room temperature.

 

 

•What is ACP 120 used for?

ACP 120 is a nano film designed as a low-cost alternative to gold coatings currently used on pins.

 

 

•Does YINCAE offer a conductive wafer level adhesive?

Yes, ACP 158 is an anisotropic conductive adhesive designed for wafer level applications.

 

 

•There are four products in the WL 66 Series, what are the differences?

WL 66 C / L / O all have different viscosities and are intended for the same purpose: wafer level lens and optical lens attachment materials. WL 66H is designed for wafer level die attach applications

 

 

•Are the products shown on your wafer level tree the only materials available in this category?

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

 

 

•Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE wafer level materials available?

Yes, please contact us using one of the links provided below.

 

 

Contact us

Technical Support

 

 

 

 

 

 

 

 

 

 

 

 

 

SEMICON West 2017

July 11-13th

Moscone Center / BOOTH 5248 north hall

San Francisco, CA

 

SMTA International 2017

September 19-20th

Donald Stephens

Convention Center / BOOTH 329

Rosemont, IL

 

iMAPS 2017

October 10-12th

Symposium Microelectronics

BOOTH 416

Raleigh, NC

 

 

 

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Do you have a question or would like to know more?

Please contact us.

We will be happy to assist you.

 

 

 

Technical Questions

 

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