►  Stand-off Height of Solder Joints

Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.

Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.

►  Weibull Plot of Thermal Cycling Failure

     Using Solder Joint Encapsulant

 Thermal Cycling Conditions:  SAC305; I/O 1156; -55°C~150°C; 1h/cycle.