單組份 100% 固體熱固化蓋板密封膠，吸濕率極低

應用方式

點膠

固化條件

150°C，持續 5-10 分鐘

黏度

50-100 Kcp

熱膨脹係數

65 ppm/°C

回流焊溫度

N/A

產品特點

高性價比解決方案，助力規模化生產

對 PCB、銅、陶瓷、玻璃或鋁具有優異附著力

Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.

極低的吸濕率

Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.

易于流动控制

Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.

產品優勢

提供長期可靠性能

固化后对所有表面提供优异保护

Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.

适用于严苛应用环境优化设计

Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.

适用于严苛应用环境优化设计

Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.

可下載資源

技術文件

技術資料表（TDS）

檔案類型

PDF

上傳日期

Apr 2026

檔案大小

333kb

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