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DA 120
產品介紹
適用於晶片與蓋板貼附的膠黏劑，具低模量與低玻璃轉移溫度
應用方式
點膠
,
固化條件
120°C，2 小時
黏度
5-8 Kcp
熱膨脹係數
65 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
固化後仍保持柔韌性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
優異的附著力
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
适用于需要电气绝缘的场合
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
低粘度，易于涂布
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
高可靠性
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
高可靠性
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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