無溶劑、快速固化的熱固型晶片貼附膠，具高導電性

應用方式

點膠

印刷

固化條件

150°C，6–10 分鐘

黏度

10-50 Kcp

熱膨脹係數

32 ppm/°C

回流焊溫度

N/A

產品特點

高性價比解決方案，助力規模化生產

混合填料功率型晶片黏著膠

Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.

優異的耐濕性

Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.

高导电性

Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.

產品優勢

提供長期可靠性能

适用于小尺寸及大尺寸芯片贴装

Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.

高温可靠性

Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.

高温可靠性

Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.

可下載資源

技術文件

技術資料表（TDS）

檔案類型

PDF

上傳日期

Apr 2026

檔案大小

333kb

下載

勇於創新

微晶片應用高性能工程材料

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