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DA 90UV
產品介紹
單組分、100%固含量的晶片貼附膠，可在數秒內固化
應用方式
點膠
,
印刷
,
固化條件
在 365 nm 紫外光（365 W/in，強度 2–5 W/cm²）照射下數秒即可固化；或於 110-300°C 固化 30-120 分鐘
黏度
50-100 Kcp
熱膨脹係數
20 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
低吸濕率
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
可在數秒內以 UV 固化，用於快速固定目的
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
具备高温回流性能
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
专为光学、光纤及光电子器件设计
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
针对光学清晰度与稳定性优化
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
针对光学清晰度与稳定性优化
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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