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LCD 66F
產品介紹
單組分、100%固含量、UV可固化的LCD封邊膠
應用方式
點膠
,
固化條件
暴露於 365 瓦/英吋、波長 365nm、強度 2–5 W/cm² 的紫外線下數秒，即可完成
熱固化於 110°C，持續 45–60 分鐘
黏度
10-12 Kcp
熱膨脹係數
75 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
优异的附着力
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
易於流動控制
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
極低吸濕率
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
提升显示器寿命
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
UV快速固化以实现高产能
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
UV快速固化以实现高产能
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
勇於創新
微晶片應用高性能工程材料
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