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NC 256
產品介紹
免清洗助焊劑，於回流焊後無殘留物
應用方式
浸鍍
,
點膠
,
印刷
,
固化條件
從室溫升至峰值溫度的時間應為 4–5 分鐘，峰值溫度 230–260°C
黏度
3-10 Kcp
熱膨脹係數
N/A
回流焊溫度
使用溫度範圍：230 至 260°C
產品特點
高性價比解決方案，助力規模化生產
01
免除清洗製程
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
優異的焊接潤濕性
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
无助焊剂残留
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
耐高温兼容性
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
与 YINCAE 底部填充材料体系兼容
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
与 YINCAE 底部填充材料体系兼容
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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