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SMT 256C
產品介紹
低黏度、易流動，適用於封裝製程
應用方式
浸鍍
,
點膠
,
印刷
,
固化條件
從室溫升至峰值溫度的時間應為 4–5 分鐘，峰值溫度 230–260°C
黏度
5-8 Kcp
熱膨脹係數
65 ppm/°C
回流焊溫度
使用溫度範圍：230 至 260°C
產品特點
高性價比解決方案，助力規模化生產
01
提升焊點可靠性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
消除焊點裂紋
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
无需底部填充
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
易于返工
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
高应力条件下仍具高可靠性
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
高应力条件下仍具高可靠性
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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