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SMT 256ED
產品介紹
可焊接型膠黏劑，具備優異抗跌落性能，適用於高溫無鉛製程
應用方式
點膠
,
固化條件
從室溫升至峰值溫度的時間應為 4–5 分鐘，峰值溫度 230–260°C
黏度
30-50 Kcp
熱膨脹係數
23.5 ppm/°C
回流焊溫度
使用溫度範圍：230 至 260°C
產品特點
高性價比解決方案，助力規模化生產
01
優異的導電性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
結合焊接與封裝功能
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
高温应用
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
提升耐热循环、机械应力及振动性能
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
降低焊点开裂与互连疲劳
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
降低焊点开裂与互连疲劳
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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