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SMT 266
產品介紹
高可靠性、可噴塗版本的 SMT 256，適用於大面積覆蓋
應用方式
噴塗
,
噴射
,
固化條件
從室溫升至峰值溫度的時間應為 4–5 分鐘，峰值溫度 230–260°C
黏度
6-10 Cp
熱膨脹係數
65 ppm/°C
回流焊溫度
使用溫度範圍：230 至 260°C
產品特點
高性價比解決方案，助力規模化生產
01
提升焊點可靠性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
優異的耐濕性
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
优异的机械强度
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
防止焊点疲劳与开裂
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
减少二次保护材料需求
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
减少二次保护材料需求
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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