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TM 150E2
產品介紹
可焊接導電膠黏劑，能輕易填充間隙、自流平，並可控制黏結層厚度（BLT）
應用方式
點膠
,
固化條件
工業標準低溫含鉛回流焊（峰值溫度 140–170°C）
黏度
50-100 Kcp
熱膨脹係數
23.5 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
提升導熱性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
消除放氣現象
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
低温固化
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
适用于温度敏感元件
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
降低组装过程中的热应力
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
降低组装过程中的热应力
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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