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UF 88UL
產品介紹
結合毛細底部填充材料低成本優勢與紫外線膠快速固化特性的超快速固化膠黏劑，且可在室溫下固化。
應用方式
點膠
,
固化條件
120°C，15–30 分鐘
黏度
100-200 Cp
熱膨脹係數
55/122 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
卓越的可靠性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
與所有免清洗助焊劑相容
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
易於返工
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
提升生产效率，实现更高产能
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
适用于CSP与倒装芯片先进封装
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
适用于CSP与倒装芯片先进封装
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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