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UVA 88A
產品介紹
雙重固化UV黏接膠，專為光學器件貼合設計
應用方式
點膠
,
固化條件
在 365 nm 紫外光（365 W/in，強度 2–5 W/cm²）照射下數秒即可固化
或於 110°C 固化 30 分鐘
黏度
6-50 Kcp
熱膨脹係數
65/182 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
卓越的熱循環性能
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
高製程良率
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
优异的低温固化性能
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
適用於將玻璃蓋板鍵合至陶瓷或 FR4 基板
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
专为高产能生产环境设计
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
专为高产能生产环境设计
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
勇於創新
微晶片應用高性能工程材料
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