What Engineers Need to Know

SMT 266, a room-temperature stable and jettable solder joint encapsulant adhesive designed to replace traditional capillary underfill.

The SMT 88U series, a novel reworkable underfill designed to provide a low-cost manufacturing solution for modern electronic devices.

TM 230, a high-thermal-conductive solderable adhesive developed by YINCAE Advanced Materials to address heat dissipation challenges in high-power LEDs and other electronic devices.

Solutions designed for ultra-low bumped (10µ) 3D TSV packages, that demonstrate superior flowability and reliability compared to competitors, effectively addressing process and reliability challenges by providing void-free application and passing extensive thermal and pressure tests.

The development of a room-temperature, fast-flow reworkable underfill (Underfill Y) designed to address the challenges of underfilling advanced components like Land Grid Arrays (LGA) and Quad Flat No-Leads (QFN) with narrow 10-20 micron gaps.

The development of Solder Joint Encapsulant (SJE) paste, a high-reliability assembly solution designed for miniaturized electronic devices and high-temperature applications.

High-reliability, high-throughput ball bumping process using Solder Joint Encapsulant Adhesives (SJEA) as an alternative to traditional tacky flux, Eliminating the need for cleaning & underfilling processes.

SMT 158HA underfill with high reliability, zero outgassing, is fully compatible with flux residue and passes 5x 260°C reflow process.