Frequently Asked Questions

Yes. We will send you the storage requirements when your order is shipped out.

Yes, please contact us for additional information.

We cannot account for all curing ovens and heat transfer rates. When creating the curing profile, we tried to consider parameters for most ovens as well as typical environmental conditions; however, ovens can have various heat transfer rates. Aside from the oven, environmental conditions (i.e. temperature inside the building) may vary in different settings. Because of this, the product may require additional time to cure.

The product was not cured. This will cause the glass transition temperature to appear low.

Yes. The viscosity will be increased and the yield will drop.

The most likely cause is improper thawing. Please contact YINCAE for more information regarding your specific product.

No, please do not vacuum seal the bag as this will evaporate the hardener preventing the product from curing. You only need to make sure the bag is sealed. You can push the air out of the bag with your hands.

You should let the syringe sit at room temperature for a total of 45-60 minutes to thaw.

Viscosity, slump and solder wetting.

Unstable pressure, air bubbles and particles aggregating together would cause that to happen. We have to dispense the material to make sure there is no broken line or clogged needle.

We normally degas.

We can use a sieve test according to IPC standards.

The most flux residue is typically from solder paste. The residue from dipping flux typically is much less than solder paste.

MEK is Methylethylketone.

YINCAE's Wafer Level and Optical lens attachment materials offer high throughput and process yield, high reliability, and are also non-yellowing products.

YINCAE WL 66H is designed for Wafer-Level die attach applications.

Yes, YINCAE offers multiple products that would be suitable, including WL 66C, WL 66L, and WL 66O.

WL 66 C / L / O all have different viscosities and are intended for the same purpose: wafer level lens and optical lens attachment materials. WL 66H is designed for Wafer Level Die attach applications.

Yes, ACP 158 is an anisotropic conductive adhesive designed for Wafer Level applications.

WTA 60 is a temporary bonding adhesive designed for thin wafer protection. WTA 60 prevents damage to wafers during standard semiconductor equipment processing. It is removed using YINCAE WTR 50.

WCP 45 is an aqueous polymer coating designed to protect wafers during laser dicing, drilling, and grooving procedures. It can easily be removed using D.I. water at room temperature.

ACP 120 is a Nano film designed as a low-cost alternative to gold coatings currently used on pins.

Yes, YINCAE LEN 66A / 66AL are colorless, fast, UV curable bonding adhesives for lens bonding applications.

YINCAE's LEN 66 Series products offer low thermal stress, high throughput, high process yield and realiability, excellent moisture resistance, and can also withstand harsh environmental conditions.

YINCAE's UVA 88 Series products have low-temperature curing properties, high process yield and reliability, and also excellent moisture and solvent resistance.

Yes, DA 90UV.

YINCAE UVA 88A Series products are dual cure UV adhesives designed for optical device bonding applications. YINCAE UVA 88E Series products are dual cure UV encapsulants designed for optical device bonding applications.

OF 66B/C are dual cure (Heat + UV) optical, fiber optic, and optoelectronic devices.

YINCAE LCD 66F is a UV curable LCD end sealant offering low moisture absorption. YINCAE LCD 66L is a UV curable, bio-compatible, optical bonding adhesive designed for LCD screen bonding applications.

YINCAE's LEN 66A/66AL are colorless, fast-cure, UV curable bonding adhesives for lens bonding applications.

YINCAE's UVA 88A Series products are dual cure UV adhesives designed for optical device bonding applications. YINCAE UVA 88E Series products are dual cure UV encapsulants designed for optical device bonding applications.

UVC 88F – designed for flexible substrates

UVC 88P – designed for rigid substrates

UVC 88G – biocompatible flexible hydrogel coating

UVC 88B – biocompatible flexible polymer coating

EMC 25 and 25A biocompatible, flexible, hydrogel(EMC 25) and polymer(EMC 25A) coatings are designed for protect surfaces from electromagnetic interference and improve surface conductivity. They are also designed for flexible and rigid substrates. They are also used to prevent corrosion and rust on metal surfaces and other solderable surfaces.

NCF 25 is an anti-oxidation solderable coating designed to prevent corrosion and rust on metal surfaces, including nickel, steel, aluminum and solderable surfaces.

BF 90S and BF 150S are lid sealants designed to protect surfaces, such as: PCB, copper, ceramic, glass, or aluminum, from moisture, dust, chemicals and other harsh environmental conditions.

Yes.

Thawing should be done at room temperature. Heat the nozzle to 50-60 C when in use.

1 micron.

Please contact us to discuss your specific application methods and to see which way is best for you.

>0.15mm.

Use VPO oven cure.

Yes, mainly used in space, military, and automobile applications.

100-110C.

YINCAE's SMT 88 Series Underfills and SMT 158UL.

YINCAE's SMT 158 and SMT 158HA Series Capillary Underfills.

YINCAE's WL 125 Series Wafer Level Underfills.

Use an – I – dispensing pattern starting on the long side.

Use an – I – dispensing pattern starting on the long side.

Use an – L – dispensing pattern.

Yes, YINCAE offers a wide range of underfills including Board Level Capillary Underfills, Package Level Capillary Underfills, Non-Flow Underfills, Reflowable Underfills and Thermal Underfills.

Yes, contact us with material requirements and we can send product information for what materials we think suit your needs best.

Yes. YINCAE's SMT 158 and SMT 158HA Series Underfill Materials are permanent.

Yes. YINCAE's SMT 88 Series and SMT 158UL Underfill Materials are reworkable.

Yes. YINCAE's SMT 160, SMT 160L, and SMT 158R are some examples.

YINCAE's reflowable (no-flow) Underfill Materials are designed to eliminate Capillary Underfills, combine underfilling and soldering processes, increase throughput, and reduce the overall cost. They do not flow from areas where they are applied. This allows the user to apply (print or dispense) the no-flow Underfill Material and place the component in a subsequent step, ensuring a faster processing cycle time. Please contact YINCAE for us to see what reflowable (no-flow) Underfill is best for you as each has different properties.

Unfilled underfills are designed for Board-Level applications as well as applications with no C.T.E. mismatch. They are also easy to rework. Filled underfills are designed for Package Level and Wafer Level applications as well as applications with significant C.T.E. mismatch. Filled underfills are generally difficult to rework.

YINCAE SMT 88 Series and SMT 158UL Underfill Materials

No, it must be dispensed onto the entire footprint.

>0.1mm.

SMT 160 is designed for dispense and normally our customers finish one syringe in 2-3h.

There are two potential reasons: SMT 158HA was not cured properly. The product should be cured at a minimum temperature of 130°C for 1 hour and then 165°C for 2 hours. The product was not thawed properly. SMT 158HA should be thawed at room temperature in a sealed zip-lock bag for 30-90 minutes. Failure to thaw properly will lead to moisture absorption in the syringe, which will cause air bubbles to appear. This step is critical, please follow the guidelines for thawing.

SMT 158D is very hygroscopic and fast flowing, so when it is taken out of the freezer and placed at room temperature, the large temperature gradient will cause it to absorb moisture rapidly. The sealed zip-lock bag helps prevent this from occurring. Moisture absorption leads to underfill voids.

SMT158D is not fully cured, check on the curing steps used. Not all ovens are the same, so there might be temperature differences due to different heat transfer rates, which can affect the curing time. Please send through reflow for 1 hour at 110°C, then 1-2 hours at 130°C, and finally 10 minutes at 150°C. The cured product should have a hardness around 45D. If the product is still ‘pasty’ after completing this process, send through reflow for an additional 10 - 15 minutes at 165°C.

SMT 158D was cured too quickly. This will entrap air bubbles and lead to void formation, please follow the curing procedure described in the application notes. SMT 158D may have also not been thawed properly causing the product to absorb moisture. Please follow thawing procedures.

No, please do not place SMT 158D under vacuum. This will evaporate the hardener and prevent the underfill from curing.

7-8GPa.

YINCAE's SMT 158 Series Nano Underfills offer fast cure options, no resin bleeding and high reliability. They are fully compatible with lead-free processes and are good for narrow gap underfilling.

YINCAE's SMT 88 Room Temperature Series Underfills are fast-flow, low-temperature cure Underfill Materials that have high reliability, friendly storage conditions and are easy to rework.

No.

No maximum gap, the minimum gap size is 7µm.

Slow the curing process. This will allow any potential air bubbles to rise to the surface and escape. Send the parts through reflow at 130°C for 10 minutes, then 150°C for 5 minutes, and the voids should disappear. Also, please follow thawing instructions prior to use.

SMT 158 is very hygroscopic and fast flowing and when SMT 158 is taken out of the freezer and placed at room temperature, the large temperature gradient will cause the material to absorb moisture rapidly. The sealed zip-lock bag helps prevent moisture from entering the glue. Moisture absorption leads to voids.

Two potential causes

1. Moisture absorbed by improper thawing caused excess glue to be dispensed on the chip thus causing it to “overflow” and pass underneath the chip.
2. The needle was placed too far away from the components (and/or at an angle). Moving the needle closer to the component should fix this issue. Also be sure the needle is operating at room temperature (do not heat the needle). If too much SMT 158 is being dispensed, try increasing the traverse speed of the needle. We recommend placing the needle as close as possible to the component at 90°. Recommended needle size: 22-23 gauge.

SMT 158 was not thawed properly. Failure to thaw in a zip-lock bag caused the product to absorb moisture. This can cause the needle to ‘spit out’ glue. Also, make sure the needle is operating at room temperature. Using the needle at a high temperature (i.e. 50- 70°C), will cause the glue to become more fluidic and thus drip (especially if there is pressure exerted on the piston).

Yes.

If the underfill is fully cured, there should be no outgassing. If you notice outgassing, please increase the curing time.

Practically all thermal cycling failures are caused by: improper thawing, not fully curing the product, or both.

No.

Yes.

No, please do not place the product in a centrifuge. This will exacerbate the problem. Please follow the thawing instructions prior to using the product. Improper thawing will lead to air bubbles.

You will want to do rework within 120 minutes.

2-3 hours.

No, please do not vacuum cure. This will evaporate the hardener and prevent the product from curing.

Please use MEK or Acetone.

8 hours.

8 - 12 hours.

No, please do not use vacuum seal. This will generate air bubbles and lead to void formation.

Yes, NF 160 is not good for a large BGA with larger warpage.

SMT 88 underfills are very hygroscopic and fast flowing and when the underfill is taken out of the freezer and placed at room temperature, the large temperature gradient will cause the material to absorb moisture rapidly. The sealed zip-lock bag helps prevent moisture from entering the glue. Moisture absorption leads to voids.

The needle was mostly likely placed too far away. When this happens, since the glue flows fast, it can spread uncontrollably. This can cause portions of the glue to remain on the PCB and move to areas it should not be. Please place the needle as close as possible to the chip for dispensing.

YINCAE's Solder Joint Encapsulant adhesives are epoxy based materials with a built-in flux function. During reflow, Solder Joint Encapsulant adhesives remove oxides allowing the solder joint to form, and encapsulate the solder joint in a 3D polymer network.

YINCAE's Solder Joint Encapsulant adhesives enhance solder joint strength, improve device reliability, eliminate underfill and the underfilling process, eliminate electrical issues such as dendrites and electro-migration, eliminate cleaning processes and also offer lower cost ownership.

YINCAE's Solder Joint Encapsulant adhesives are 100% reworkable which eliminates scrap costs, are air reflowable, eliminating nitrogen costs, involve a lower material usage, high process yield and shorter manufacturing process.

YINCAE's Solder Joint Encapsulant adhesives eliminate the shrinkage factor generated by underfill. The gap is filled with air while using Solder Joint Encapsulants. This ensures minimized induced stresses and improves reliability.

Yes, Solder Joint Encapsulant products provide additional mechanical strength to solder joints to help mitigate the impact of warpage. Solder Joint Encapsulants encapsulate the solder joints after reflow to prevent dendrite formation.

You can perform a pull test and should notice a significant improvement compared to that of tacky flux.

Solder Joint Encapsulants encapsulate the solder joints after reflow to prevent dendrite formation.

The material can easily be removed using MEK or acetone. IPA will not work since the material is an epoxy.

0.65.

8 hours.

No.

Yes.

Yes, we recommend using a 23-gauge needle.

Try using a stainless-steel squeegee and adjust the angle to 45°. Rubber can easily bend leading to uneven coverage.

No, it has to be used with solder paste together.

Yes.

Without solder resist— if using pin transfer, the amount of glue transferred should be equal to 85% of the ball height as a starting point With solder paste – use stencil – print glue – print solder paste on top – place solder ball.

Yes.

SMT 256 will not work for the bumping process due to bridging and missing ball issues. Please use BP 256 for ball bumping procedures.

The product will soften when heated (~250°C) and allow for easy removal.

8 hours.

No.

SMT 256 is very viscous and a nozzle that can be used for tacky flux will not have the pull strength required for SMT 256. Try increasing the nozzle size. If your component is small, forcing you to use a certain nozzle size, enlarge the nozzle cavity to maximize the vacuum force. (i.e. if your component size is 63 x 63 mm, use a nozzle with dimensions around 55 x 55mm). Also reduce the dwell time to 0.3 – 0.5 seconds.

BP 256 is a ball bumping adhesives designed to enhance solder joint strength during ball bumping processes. The key advantages of BP 256 are enhanced solder bonding strength, increased throughput, elimination of additonal cleaning steps and underfilling processes, and overall lowers operational costs.

Try using a stainless-steel squeegee and adjust the angle to 45°.

8 hours.

No.

No.

Pin transfer or printing.

Yes, however you will need a support structure for the wafer to prevent it from breaking.

40-50 µm.

No, the reballing process for BP 256 is the same as the standard industrial process. BP 256 contains a flux function, therefore you do not need to add flux.

Max thawing time for BP 256 is 2 hours. At room temperature, the viscosity will increase preventing solder bumps from being encapsulated.

No.

The advantages include high reliability, low-temperature processing, high conductivity, and void-free interfaces.

YINCAE's Thermal Interface Materials support bare die attach and advanced packaging workflows, can replace or compliment silver epoxy, solder paste/preform, grease, and pads, and also can balance thermal transfer with mechanical compliance where needed.

TM 150 Series.

TM 230 Series

TGP 110 & TGP 110A

TM 150LM + LA 150.

TM 158/DA 158A.

YINCAE's DA 90 Series Die Attach Adhesives.

Many of YINCAE's DA 150 Series Die Attach Adhesives cure within 15 minutes.

Yes, the DA 90 and DA 150 Series consist of both insulating and conductive Die Attach Materials.

TM series products are highly conductive solderable adhesives and can replace conductive adhesives, such as silver paste, or solder materials.

YINCAE's TM series products offer higher thermal conductivity compared to pure solder alloys, lower process temperatures and high application temperatures. TM products also eliminate outgassing issues, cleaning processes, are self-filling and self-leveling, and can withstand harsh environments

YINCAE's WL 66H is designed for Wafer Level Die Attach applications

Yes, a metal surface is not suitable, but a PCB surface (polymer like solder resist) is ok.

No.

No, SMT 256EP is a paste.

YINCAE's DA 90 and DA 150 Series both offer low temperature options, low temperature cure for high temperature applications (400°C), excellent mechanical resistance, a high temperature reflow, high reliability and also minimimize induced stresses.

Please contact us with your location and we can pair you with the nearest sales representative to offer support.

Yes. Please contact us and we can help arrange a meeting.

Yes. Please contact us and we can help arrange a meeting.

Please see YINCAE's Career Opportunities.

Yes.

We package the materials in thermal coolers with dry ice to help safeguard a below freezing temperature. We try to ship using next day delivery services to all domestic locations. We try to ship using the fasted method on all international and domestic shipments.

See the FedEx list of countries where Dangerous Goods services are available.

You are provided with a tracking number to track your shipment for any customs delays. If you were not provided with a tracking number, please contact us to receive one.

Please have the receiver ready to pay duties and taxes on a shipment if your country requires. YINCAE is not responsible for any duties or taxes accrued during a shipment.

Please contact us at info@yincae.com for more information.

The sample size depends on your specific needs. Please contact us at info@yincae.com for more information.

The typical lead time is 2-4 weeks, but depends fully on the quantity requested. Please contact us at info@yincae.com for more information.

Please contact us at info@yincae.com for more information.