What Engineers Need to Know

The use of solder joint encapsulant adhesives as a reliability solution for interconnects between flexible and rigid substrates.

The development and performance of solderable anisotropic conductive adhesives (SACAs) designed for 3D packaging with ultra-low bump heights (10µ).

The development and performance of a low-temperature solder joint encapsulant adhesive (SJEA) designed specifically for Sn/Bi (tin/bismuth) soldering applications.

The development of a high thermal conductive flip chip underfill using diamond powder as a filler to meet the requirements of advanced 3D stacked multi-chip packaging.

SMT 88U series, a novel low-temperature, fast-flow, and fast-cure reworkable underfill developed by YINCAE Advanced Materials.

SMT 256 and SMT 266, the first individual solder joint encapsulant adhesives designed for Package-on-Package (POP) with Through-Mold Vials (TMV) mass production.

SMT 256 and SMT 266, the first solder joint encapsulant adhesives designed for Package-on-Package (POP) assembly, particularly those with through-mold vias (TMV).

SMT256 and SMT266, solder joint encapsulant adhesives designed as high-reliability, low-cost assembly solutions for Land Grid Array (LGA) and Package-on-Package (POP) components.

The development and performance of solder joint encapsulant adhesives as a high-reliability alternative to traditional underfill processes.