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Engineering Materials for Micro-Chip Applications
Foundation
High-performance Underfill Materials, Die Attach Adhesives, Optoelectronic Materials, Solder Joint Encapsulants and Thermal Interface Materials Designed for Reliability, Thermal Performance, and Scalable Manufacturing
Trusted by Fortune 10 Clients
2x
Global Technology Award Winner
Innovations protecting our proprietary chemistry and processes.
20+
Locations World Wide
Global distribution network supporting international technical teams.
30+
Years of Operations
Decades of experience in advanced materials solutions.
World's First Products
Materials That Redefined Industrial Standards
Two category-first breakthroughs developed through materials science—built to solve failure modes that conventional chemistries can’t.
UF 158D
Fast-flow, easily reworkable, thermal diamond underfill.
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SMT 256
Highly reliable solder joint encapsulant that eliminates cracking and the need for underfill.
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Solder Joint Encapsulants
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Solder Joint Encapsulants
Underfill Materials
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Underfill
Die Attach Materials
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Die Attach
Optoelectronic Materials
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Optoelectronic
Wafer Level Materials
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Wafer Level
Thermal Interface Materials
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Theremal Interface
Conformal Coatings
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Conformal Coatings
Solder Joint Encapsulants
Underfill
Die Attach
Optoelectronic
Wafer Level
Thermal Interface
Conformal Coatings
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9
Sep
Shenzhen World Expo Center, China
IICIE 2026
YINCAE · Booth #
14C21
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28
Sep
Encore Boston Harbor - Boston, MA
iMAPS 2026
YINCAE · Booth #
408
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13
Oct
Moscone Center - San Francisco, CA
Semicon West 2026
YINCAE · Booth #
3411
View event
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Consumer Electronics
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Automotive Electronics
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Aviation
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Medical Devices
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Defense
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Solar Energy
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Telecommunications
standards
Our Commitment to Compliance
ISO 9001:2015 Certified
YINCAE operates under an ISO 9001:2015 certified Quality Management System, ensuring consistent quality and controlled manufacturing processes.
Industry-Aligned Materials
Products are developed for advanced electronics and microelectronics and aligned with common industry and customer compliance requirements.
Ongoing Compliance Efforts
YINCAE continually reviews and improves compliance across privacy, accessibility, security, and environmental responsibility as standards evolve.
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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