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SMT 256
About this product
Enhances solder joint reliability and eliminates underfill and cracking
Application Method
Dipping
,
Dispensing
,
Printing
,
Curing Conditions
Ambient to peak temperature time to be 4-5minutes with peak temperature from 230-260°C
Viscosity
5-20 Kcp
C.T.E
65 ppm/°C
Reflow Temperature
230-260°C for reflow
features
Cost-effective solutions, built for scale
01
Enhances solder joint reliability
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Eliminates solder joint cracking
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Eliminates need for underfill
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Fewer process steps
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
High reliability
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
High reliability
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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