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UF 158D
About this product
Fast-flow, easily reworkable, thermal diamond underfill
Application Method
Dispensing
,
Curing Conditions
130℃ for 2 hours
Viscosity
5-10 Kcp
C.T.E
5-15/50-80 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
High thermal conductivity
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Excellent mechanical shock performance
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Outstanding thermal cycling performance
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Suitable for bare chip protection in a variety of packages
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Suitable for underfill in a variety of packages
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Suitable for underfill in a variety of packages
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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