各向異性導電膠黏劑，可為高密度互連與小型化提供可靠的解決方案

應用方式

點膠

固化條件

在線固化，或 150°C 固化 5-10分鐘

黏度

5-8 Kcp

熱膨脹係數

28/125 ppm/°C

回流焊溫度

N/A

產品特點

高性價比解決方案，助力規模化生產

卓越的熱循環性能

Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.

设计用于渗入狭窄间隙

Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.

高熱穩定性

Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.

產品優勢

提供長期可靠性能

将多个工艺步骤整合为更少步骤

Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.

支持先进封装应用

Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.

支持先进封装应用

Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.

可下載資源

技術文件

技術資料表（TDS）

檔案類型

PDF

上傳日期

Apr 2026

檔案大小

333kb

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