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ACP 158L
About this product
Anisotropic conductive adhesive that can provide a reliable solution for high density interconnect and miniaturization
Application Method
Dispensing
,
Curing Conditions
In-line, or 150°C for 5-10 minutes
Viscosity
5-8 Kcp
C.T.E
28/125 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Outstanding thermal cycling performance
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Designed to flow into tight gaps
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
High thermal stability
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Combines processes into fewer steps
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Supports advanced packaging applications
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Supports advanced packaging applications
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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