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BF 90S
產品介紹
單組份 100% 固體熱固化蓋板密封膠，吸濕率極低
固化條件
90°C，持續 45分鐘
黏度
10-20 Kcp
熱膨脹係數
65 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
極低的吸濕率
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
低溫熱固化
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
对 PCB、铜、陶瓷、玻璃或铝具有优异附着力
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
固化后对所有表面提供优异保护
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
支持低温工艺
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
支持低温工艺
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
勇於創新
微晶片應用高性能工程材料
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