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BF 90S
About this product
One-part, 100% solid, thermal cure lid sealant with very low moisture absorption
Curing Conditions
90°C for 45 minutes
Viscosity
10-20 Kcp
C.T.E
65 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Very low moisture absorption
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Low temperature thermal cure
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Excellent adhesion to PCB, Copper, Ceramic, Glass, or Aluminum
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Excellent protection to all surfaces after cure
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Enables lower-temperature processing
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Enables lower-temperature processing
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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