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BP 256
產品介紹
無溶劑、快速固化的熱固型晶片貼附導電膠，具高導電性
應用方式
印刷
,
固化條件
從室溫升至峰值溫度的時間應為 4–5 分鐘，峰值溫度 230–260°C
黏度
25-65 Kcp
熱膨脹係數
N/A
回流焊溫度
從室溫升至峰值溫度的時間應為 4–5 分鐘，峰值溫度 230–260°C
產品特點
高性價比解決方案，助力規模化生產
01
焊點強度比傳統方法高出 5–10 倍
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
免除後清洗製程需求
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
无需使用底部填充材料
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
易于返工
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
优异的工艺兼容性
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
优异的工艺兼容性
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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