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BP 256
About this product
Solvent-free and fast curing thermosetting Die Attach adhesive with high electrical conductivity
Application Method
Printing
,
Curing Conditions
230-260°C for 4-5 minutes
Viscosity
25-65 Kcp
C.T.E
N/A
Reflow Temperature
230-260°C for 4-5 minutes
features
Cost-effective solutions, built for scale
01
5-10x stronger solder joints than conventional methods
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Eliminates the need for post-cleaning
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Eliminates the need for an underfill material
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Easily reworkable
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Excellent process compatibility
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Excellent process compatibility
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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