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OA 66AL
產品介紹
單組分、100%固含量、UV可固化的黏接膠
應用方式
點膠
,
固化條件
暴露於 365 瓦/英吋、波長 365nm、強度 2–5 W/cm² 的紫外線下數分鐘
如有需要，隨後於 90–100°C 進行 30 分鐘熱固化
黏度
0.3-0.5 Kcp
熱膨脹係數
65 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
高產能與製程良率
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
低熱應力
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
优异的耐湿性
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
提供无气泡光学覆盖（固化后）
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
形成高柔性键合结构
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
形成高柔性键合结构
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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