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SMT 138E
產品介紹
導電型、快速固化、自流平且可自焊接的膠黏劑
應用方式
點膠
,
固化條件
從室溫升至峰值溫度的時間應為 4–5 分鐘，峰值溫度 140–185°C
黏度
50-100 Kcp
熱膨脹係數
23.5 ppm/°C
回流焊溫度
使用溫度範圍：140 至 190°C
產品特點
高性價比解決方案，助力規模化生產
01
優異的導電性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
消除接觸電阻
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
低温焊接应用
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
消除焊接过程中的放气
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
消除助焊剂残留
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
消除助焊剂残留
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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