.webp)
.webp)
.svg)
TGP 110-2
產品介紹
反應型導熱膏，具超薄黏結層厚度（BLT），可消除粗糙界面的微氣泡
應用方式
點膠
,
印刷
,
固化條件
無需額外固化—在使用過程中緩慢固化
黏度
20-50 Kcp
熱膨脹係數
30 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
高導熱性
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
可隨時間逐步固化
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
反应型导热硅脂与胶黏剂复合体系
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
高可靠性
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
降低空洞率，提升长期性能
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
降低空洞率，提升长期性能
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
.svg)
.svg)