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TGP 110-2
About this product
Reactive thermal grease product with very thin BLT that eliminates micro-bubbles at the rough interface
Application Method
Dispensing
,
Printing
,
Curing Conditions
No additional curing required — slowly cures during use.
Viscosity
20-50 Kcp
C.T.E
30 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
High thermal conductivity
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Can cure over time
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Reactive thermal grease & adhesive hybrid
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
High reliability
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Reduces voiding for better long-term performance
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Reduces voiding for better long-term performance
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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