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UF 158LA
產品介紹
快速流動、低溫、慢速固化的高性能液態環氧底部填充材料
應用方式
點膠
,
固化條件
150°C，1 小時
黏度
5-8 Kcp
熱膨脹係數
22/112 ppm/°C
回流焊溫度
N/A
產品特點
高性價比解決方案，助力規模化生產
01
卓越的熱循環性能
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
與助焊劑殘留物100%相容
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
5×260°C 回流
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
產品優勢
提供長期可靠性能
01
快速流动，缩短循环时间
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
降低空洞风险
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
降低空洞风险
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
可下載資源
技術文件
技術資料表（TDS）
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
333kb
安全資料表 (SDS)
檔案類型
PDF
上傳日期
Apr 2026
檔案大小
303kb
勇於創新
微晶片應用高性能工程材料
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