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UF 158LA
About this product
Fast-flow, low-temperature, slow cure and high liquid epoxy underfill
Application Method
Dispensing
,
Curing Conditions
150℃ for 1 hour
Viscosity
5-8 Kcp
C.T.E
22/112 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Outstanding thermal cycling performance
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
100% compatible with Flux Residue
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
5x260°C Reflow
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Fast flow enabling shorter cycle times
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Reduced voiding risk
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Reduced voiding risk
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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