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ACP 120
About this product
Anti-oxidation Solderable Coating designed for anti-corrosion and anti-rusting
Application Method
Dipping
,
Spray
,
Immersion
,
Curing Conditions
Room Temperature
Viscosity
12-15s
C.T.E
N/A
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Excellent solderability
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Excellent anti–oxidation
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Easily reworked using methyl ethyl ketone to remove
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Low Cost Ownership
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Room temperature process
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Room temperature process
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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