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ACP 158
About this product
Electrically conductive adhesive that can provide a reliable solution for high density interconnect and miniaturization
Application Method
Dispensing
,
Curing Conditions
In Line, or 150-280°C for 5-10 minutes
Viscosity
5-8 Kcp
C.T.E
30/135 ppm/°C
Reflow Temperature
Use hot bar at 1kgf/10 seconds
Internal temperature to reach 230°C
features
Cost-effective solutions, built for scale
01
Outstanding thermal cycling performance
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
High electrical conductivity
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Excellent adhesion to multiple substrates
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
High reliability interconnections
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Minimizes induced stress
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Minimizes induced stress
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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