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DA 90-50
About this product
Solvent-free and fast cure thermosetting Die Attach adhesive with high thermal conductivity
Application Method
Dispensing
,
Printing
,
Curing Conditions
170-190°C for 30-50 minutes
Viscosity
45-60 Kcp
C.T.E
35 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Excellent Moisture Resistance
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
High Thermal Conductivity
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
High Adhesive Strength
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
High Reliability
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Minimizes induced stress
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Minimizes induced stress
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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