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DA 90B
About this product
Solvent-free, fast cure, thermosetting Die Attach adhesive with high thermal conductivity
Application Method
Dispensing
,
Printing
,
Curing Conditions
150-170°C for 30-50 minutes
Viscosity
10-50 Kcp
C.T.E
35 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Non-conductive
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Low-temperature cure
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Silica-filled with high thermal conductivity
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Improves thermal management
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Supports high-throughput manufacturing
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Supports high-throughput manufacturing
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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