Conductive, rapid-cure, self-leveling and self-soldering adhesive

Application Method

Dispensing

Curing Conditions

Ambient to peak temperature time to be 4-5 minutes with peak temperature from 140-190°C

Viscosity

20-35 Kcp

C.T.E

23.5 ppm/°C

Reflow Temperature

140-190°C Reflow

features

Cost-effective solutions, built for scale

Excellent electrical conductivity

Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.

Low temperature soldering

Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.

High temperature application

Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.

benefits

Designed for Long-Term Reliability

Eliminates out gassing from soldering processes

Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.

Eliminates flux residue

Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.

Eliminates flux residue

Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.

downloadables

Technical Documentation

Technical Datasheet (TDS)

File type

PDF

Date Uploaded

Apr 2026

Size

333kb

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