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SMT 156
About this product
Conductive, rapid-cure, self-leveling and self-soldering adhesive
Application Method
Dispensing
,
Curing Conditions
150°C for 5 minutes
Viscosity
500-700 Kcp
C.T.E
23.5 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
High viscosity formulation
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Self-soldering capability
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Higher electrical and thermal conductivity that remains stable
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Eliminates die skewing & shifting
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Can tolerate harsh environmental conditions
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Can tolerate harsh environmental conditions
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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