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TM 230
About this product
Rapid cure, self-filling, self-leveling, and self-soldering adhesive
Application Method
Dispensing
,
Curing Conditions
230℃ for 60 seconds
Viscosity
30-45 Kcp
C.T.E
21.7 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Improved thermal conductivity
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Eliminates outgassing
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Ultra-fast bonding performance
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Ideal for demanding semiconductor packaging
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Faster throughput in high-temperature assembly lines
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Faster throughput in high-temperature assembly lines
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Safety Data Sheet (SDS)
File type
PDF
Date Uploaded
Apr 2026
Size
303kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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