Highly filled, high purity liquid epoxy underfill that can flow into narrow gaps

Application Method

Dispensing

Curing Conditions

150℃ for 20 minutes excluding ramp up time

Viscosity

6-9 Kcp

C.T.E

28/88 ppm/°C

Reflow Temperature

N/A

features

Cost-effective solutions, built for scale

Outstanding thermal cycling performance

Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.

100% compatible with Flux Residue

Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.

5x260°C Reflow

Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.

benefits

Designed for Long-Term Reliability

Easy reworkability

Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.

Lower viscosity which enables easier dispensing

Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.

Lower viscosity which enables easier dispensing

Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.

downloadables

Technical Documentation

Technical Datasheet (TDS)

File type

PDF

Date Uploaded

Apr 2026

Size

333kb

Download

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