Super-fast curing adhesive that combines the advantages of low-cost ownership of capillary underfills and the fast-cure of UV adhesives, but can be cured at room temperature.

Application Method

Dispensing

Curing Conditions

135℃ for > 10 minutes

Viscosity

150-300 Cp

C.T.E

65/182 ppm/°C

Reflow Temperature

N/A

features

Cost-effective solutions, built for scale

Outstanding reliability

Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.

Easy reworkability

Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.

Excellent low temperature cure performance

Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.

benefits

Designed for Long-Term Reliability

Suitable for bare chip protection in a variety of packages

Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.

Designed for high production environments

Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.

Designed for high production environments

Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.

downloadables

Technical Documentation

Technical Datasheet (TDS)

File type

PDF

Date Uploaded

Apr 2026

Size

333kb

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Engineering Materials for Micro-Chip Applications

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