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UVA 88C
About this product
Corner bond and underfill replacement that is void free after cure
Application Method
Dispensing
,
Curing Conditions
Few seconds with UV (365nm, 2-5 W/cm²)
Thermal cure at 110°C for 30 minutes if necessary
Viscosity
15-50 Kcp
C.T.E
75/182 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Outstanding reliability performance
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
Excellent low temperature cure performance
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Easy reworkability
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
Achieves high reliability enhancement application as corner bond and underfill replacement
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Low cost ownership
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Low cost ownership
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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