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WL 66C
About this product
One-part, 100% solid, dual cure, UV bonding adhesive designed for wafer-level lens or optical lens attachment
Application Method
Dispensing
,
Printing
,
Curing Conditions
Few seconds with UV(365nm, 2 - 5 W/cm2).
Viscosity
10-30 Kcp
C.T.E
65 ppm/°C
Reflow Temperature
N/A
features
Cost-effective solutions, built for scale
01
Non-yellowing after three lead-free reflow cycles
Maintains mechanical and chemical stability during high-temperature assembly processes, including Pb-free reflow profiles and prolonged thermal exposure.
02
High throughput & process yield
Engineered to achieve reliable adhesion across common PCB substrates, reducing the risk of delamination during thermal cycling and operational stress.
03
Moisture resistant & thermally stable
Formulated to minimise mechanical stress at the solder joint interface, helping to mitigate fatigue and micro-cracking over the product’s operational lifetime.
benefits
Designed for Long-Term Reliability
01
High reliability
Enhances solder joint durability under repeated thermal cycling and mechanical loading, supporting long-term performance in demanding environments.
02
Designed for wafer-level lens or optical lens attachment
Lowers the likelihood of mechanical and thermal failure in high-temperature and high-density assemblies, improving overall system robustness.
03
Designed for wafer-level lens or optical lens attachment
Supports stable, repeatable production outcomes by reducing process variability and material-related defects across manufacturing runs.
downloadables
Technical Documentation
Technical Datasheet (TDS)
File type
PDF
Date Uploaded
Apr 2026
Size
333kb
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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