Stand-off Height of Solder Joints

 

Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.

  Pull Strength of Solder Joints

Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.

  Weibull Plot of Thermal Cycling Failure

     Using Solder Joint Encapsulant

 Thermal Cycling Conditions:  SAC305; I/O 1156; -55°C~150°C; 1h/cycle.



BREAKING NEWS: YINCAE Wins Global Technology Award

IWLPC 2018, October 23 - 24. San Jose, CA. Booth #47

IPC APEX Expo 2019, January 29 - 31. San Diego, CA. Booth #1720

 

Upcoming Events

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SEMICON West 2018 July 10th - 12th Moscone Center, North Hall Booth # 5269 San Francisco, CA IWLPC 2018 October 23rd - 24th DoubleTree by Hilton San Jose Booth # 47 San Jose, CA

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